| 1 | Profile A | High-current power boards | 4–8 layer FR-4, heavy-copper outer layers | 2–6 oz typical power layers | Metal-backed or copper-area thermal spreading | IPC Class 2 or Class 3, project dependent | Flame-retardant laminate; safety spacing review | AC/DC rectifiers, PFC, and DC/DC power stages |
| 2 | Profile B | Multilayer control and power-interface boards | 6–12 layer multilayer construction | 1–3 oz signal and power distribution | Thermal vias beneath switching and processor devices | IPC Class 2; Class 3 available for critical designs | Controlled impedance and creepage documentation | Charger controllers, gateway units, and monitoring boards |
| 3 | Profile C | High-voltage isolation boards | 4–10 layer boards with reinforced isolation zones | 1–4 oz copper with isolated power domains | Isolation slots, clearance control, and thermal relief | Class 2 or Class 3 according to risk assessment | Creepage, clearance, dielectric withstand, and insulation review | Voltage sensing, isolation monitoring, and protection circuits |
| 4 | Profile D | HDI communication and processor boards | Microvia HDI, sequential build-up, 6–12 layers | 0.5–2 oz signal copper | Copper planes and thermal-via arrays | IPC Class 2; Class 3 for high-reliability programs | Impedance testing, via inspection, and automated optical inspection | Ethernet, cellular, vehicle communication, and user interfaces |
| 5 | Profile E | Flexible and rigid-flex assemblies | 2–8 layer rigid-flex construction | 0.5–2 oz flexible copper sections | Localized copper planes with bend-zone restrictions | IPC Class 2; application-specific reliability testing | Flex-cycle, bend-radius, and assembly validation | Compact displays, cable-replacement assemblies, and door interfaces |
| 6 | Profile F | Metal-core thermal boards | Single- or multilayer aluminum-backed PCB | 1–4 oz copper, design-dependent | Direct heat transfer to a metal core or chassis | IPC Class 2 with thermal-cycle validation | Thermal resistance measurement and dielectric testing | Fan control, indicator modules, and heat-generating auxiliary circuits |
| 7 | Profile G | Prototype-to-production power electronics | 2–8 layer FR-4 with design-for-manufacturing support | 1–4 oz copper | Thermal-via and copper-pour optimization | Prototype inspection followed by production process controls | Design-rule review, electrical testing, and traceability | New charger platforms and engineering validation units |
| 8 | Profile H | Large-format industrial charger boards | 4–10 layer rigid multilayer boards | 2–6 oz power distribution layers | High-current planes, thermal vias, and chassis coupling | IPC Class 2 or Class 3 for continuous-duty equipment | Panel-level electrical testing and dimensional inspection | Cabinet chargers, power distribution, and auxiliary supplies |
| 9 | Profile I | Safety, metering, and protection boards | 4–8 layer FR-4 with separated analog and power domains | 1–3 oz copper | Ground-plane control and low-noise thermal design | IPC Class 2 with enhanced inspection for safety circuits | Electrical safety spacing, isolation, and functional test records | Current measurement, residual-current detection, and interlocks |
| 10 | Profile J | Cost-optimized auxiliary and interface boards | 2–6 layer FR-4 construction | 1–2 oz copper | Standard copper pours and component-level heat spreading | IPC Class 2 | Automated optical inspection and electrical continuity testing | Displays, lighting, fans, relays, and low-power control circuits |