| Intended product use | Dedicated-service electronic products where continued performance is important but uninterrupted operation is not always essential. | High-performance or high-reliability products where continued performance is essential and equipment downtime can be unacceptable. | A documented product classification agreed with the customer before design, fabrication, assembly, and inspection. |
| Acceptance standard | Meets the applicable Class 2 acceptance criteria in the referenced IPC workmanship and product standards. | Meets the applicable Class 3 acceptance criteria, which generally require more stringent control of conditions that could affect service performance. | Purchase documents identify the applicable IPC standards, revision levels, drawings, specifications, and acceptance class. |
| Visual workmanship | Visible features are evaluated against Class 2 criteria for soldering, component mounting, printed board condition, and assembly workmanship. | Visible features are evaluated against the more demanding Class 3 criteria, with less tolerance for conditions that may reduce service reliability. | Trained inspectors, calibrated microscopes and measurement tools, documented inspection records, and traceable nonconformance handling. |
| Plated-through holes and vias | Hole plating, land condition, annular ring, and barrel quality must meet the selected IPC product specification and Class 2 acceptance requirements. | The same features are controlled to Class 3 requirements where defects or marginal construction could threaten electrical or mechanical continuity. | Microsection analysis, cross-section records, drill-to-copper control, plating-thickness verification, and documented corrective action. |
| Solder joints | Solder coverage, wetting, fillets, component leads, and termination conditions must satisfy the applicable Class 2 criteria. | Solder joints must satisfy Class 3 criteria, particularly where insufficient wetting, poor coverage, or joint geometry could affect long-term function. | Process controls for solder paste, reflow or wave profiles, operator training, first-article review, and automated optical inspection. |
| Electrical integrity | The finished board must pass the electrical tests and design-specific requirements stated in the purchase documentation. | The finished board must pass the same applicable tests with acceptance conditions appropriate for high-reliability service. | 100% netlist testing where specified, insulation-resistance or hipot testing where applicable, controlled test fixtures, and retained test results. |
| Cleanliness and contamination control | Cleaning and contamination limits are determined by the product specification, process requirements, and intended operating environment. | Higher attention is normally required because ionic residues, moisture, and contamination can create leakage or electrochemical migration risks in demanding applications. | Controlled cleaning process, defined cleanliness limits, ionic contamination testing when required, and sealed handling after final cleaning. |
| Thermal and mechanical durability | Thermal cycling, thermal stress, vibration, shock, and mechanical requirements depend on the relevant board specification and product design. | The design and qualification plan must address the more demanding consequences of field failure and the specified operating environment. | Documented laminate selection, stack-up control, thermal-stress testing where applicable, and verification against the customer’s environmental profile. |
| Material and process traceability | Traceability is based on the customer’s quality agreement and applicable industry or regulatory requirements. | More extensive traceability is commonly expected for materials, processes, inspection results, and changes that could influence reliability. | Lot identification, material certificates, laminate and copper records, process history, operator or machine records, and controlled engineering changes. |
| Defect disposition | Defects are evaluated according to Class 2 criteria and the customer’s documented repair or concession process. | Potentially reliability-limiting defects receive stricter review, and use-as-is decisions require documented technical justification. | Formal nonconformance reports, root-cause analysis, corrective and preventive action, reinspection, and customer approval when required. |
| Inspection and testing evidence | Inspection depth is established by the product specification, process capability, sampling plan, and risk level. | Inspection and test coverage should be sufficient to detect conditions that could cause an in-service failure. | AOI, automated electrical testing, X-ray inspection when applicable, microsections, first-article inspection, and complete quality records. |
| Design-for-manufacturing support | Design rules should support stable manufacturing and compliance with the selected Class 2 requirements. | Design reviews should pay closer attention to impedance, thermal management, spacing, via reliability, solder-joint geometry, and manufacturability risk. | Pre-production DFM checks, stack-up review, controlled impedance documentation, manufacturability feedback, and approved design changes. |
| Reliability claim | Suitable for many commercial and industrial control applications when the design, environment, and quality controls are appropriately matched. | Appropriate for applications requiring a higher level of assurance against workmanship and construction-related failures. | The manufacturer supports claims with objective inspection data, qualification results, process capability evidence, and transparent quality communication rather than classification alone. |