| Applicable Standard Control | Confirm that the supplier can manufacture to the correct IPC product specification in addition to the generic IPC-6011 performance framework. | Documented Class 2 process controls and acceptance criteria for the ordered board type. | Documented Class 3 process controls, enhanced inspection, and traceable acceptance records for the ordered board type. | Controlled quality manual, contract review record, approved drawing, and current specification list. | Essential |
| Base Material and Laminate Control | Check material grade, nominal thickness, copper foil thickness, flammability requirement, and certificate traceability. | Material certificates and incoming inspection records match the purchase order and drawing. | Full lot traceability, tighter control of material changes, and documented verification of critical material characteristics. | Certificate of conformity, material lot number, incoming inspection report, and change-notification procedure. | Essential |
| Dimensional and Thickness Control | Evaluate control of finished board length, width, thickness, profile, hole location, and edge condition. | Inspection results demonstrate compliance with drawing tolerances and controlled routing or punching processes. | More rigorous measurement frequency, equipment calibration, and documented reaction plans for drift or out-of-control results. | First-article inspection report, calibrated measuring-equipment list, and process capability data for critical dimensions. | Essential |
| Conductor Pattern Quality | Review etching capability, conductor width and spacing control, undercut control, burr prevention, and visual inspection. | Pattern meets drawing requirements with documented checks for opens, shorts, excessive undercut, and conductor damage. | Tighter process monitoring, higher inspection sensitivity, and stronger controls against defects that could affect long-term reliability. | Automated optical inspection capability, etch-process records, defect Pareto data, and sample inspection images. | Essential |
| Plated Hole Capability | If the single-layer board uses plated-through holes, verify hole preparation, desmear or cleaning, copper deposition, and hole-wall quality. | Supplier can meet the applicable plated-hole requirements with documented cross-section and continuity checks. | Supplier can meet the applicable Class 3 hole-wall, continuity, integrity, and inspection requirements with stronger lot traceability. | Microsection reports, plated-hole thickness records, thermal-stress or solder-float test results where specified, and continuity data. | Verify if applicable |
| Solderability and Surface Finish | Assess the selected surface finish, storage controls, oxidation prevention, solderability testing, and finish uniformity. | Surface finish is compatible with the assembly process and meets the specified solderability and appearance requirements. | Stricter control of finish thickness, contamination, aging, handling, and solderability evidence for reliability-sensitive applications. | Surface-finish certificate, thickness test results, solderability test records, packaging method, and shelf-life controls. | Essential |
| Electrical Testing | Determine whether every net can be tested for opens and shorts and whether the supplier can support the required test method. | Electrical test coverage is defined for production lots, with documented fixture or flying-probe verification. | Electrical testing is supported by stronger test coverage, traceable results, controlled test programs, and documented retest rules. | Net-list comparison report, test coverage statement, test-program revision control, and sample electrical test report. | Essential |
| Cleanliness and Contamination Control | Check removal of ionic residues, etching chemicals, dust, fingerprints, and other contamination that may affect assembly or reliability. | Cleaning process is defined and verified according to the board design, assembly method, and customer requirements. | Documented cleanliness limits, controlled handling, verification records, and formal reaction plans for contamination failures. | Ionograph or equivalent cleanliness results where required, cleaning-process parameters, ESD rules, and handling records. | Recommended |
| Inspection and Defect Disposition | Review final inspection, sampling plan, nonconformance handling, rework policy, and shipment-release authority. | Inspection plan identifies rejectable defects and prevents shipment of boards outside the approved requirements. | Expanded inspection records, clear defect escalation, formal root-cause analysis, and documented customer approval for deviations. | Final inspection checklist, nonconformance report, corrective-action example, sampling standard, and lot-release record. | Essential |
| Reliability Test Support | Verify access to thermal stress, solderability, humidity, insulation-resistance, or other tests required by the design and risk level. | Supplier can perform or subcontract the tests specified in the purchase documents and retain the results. | Supplier can support the additional reliability evidence required for the application and maintain full test traceability by lot. | Test capability matrix, accredited laboratory relationship if outsourced, test reports, and sample-retention policy. | Verify by design |
| Traceability and Change Management | Check whether materials, process parameters, inspection results, operators, equipment, and shipment lots can be traced. | Lot-level traceability is available for materials and final inspection records. | More complete genealogy is maintained from raw material through process history, testing, final release, and shipment. | Sample traveler, barcode or lot-tracking workflow, engineering-change notice procedure, and record-retention policy. | Essential |
| Production Capacity and Consistency | Evaluate whether the supplier can maintain stable quality at prototype, pilot, and recurring-production volumes. | Capacity plan supports the required monthly volume with defined inspection and delivery controls. | Capacity expansion does not weaken process control, traceability, inspection frequency, or reliability testing. | Capacity statement, bottleneck analysis, on-time-delivery history, yield trend, and backup-equipment plan. | Recommended |