| Compact auxiliary or low-power inverter | 100 µH; 10 A RMS | 18–25 mΩ; approximately 1.8–2.5 W at 10 A | Check temperature rise at the intended ambient temperature and airflow; keep winding and core temperatures within their specified limits. | Compare material-specific loss data at the actual switching frequency and peak flux density. Confirm that saturation does not occur at peak current. | Approximately 30 × 30 × 20 mm | PCB through-hole pins or a mechanically secured chassis mount, depending on mass and vibration requirements. | Useful where board area is limited and ripple-current requirements allow the higher inductance. |
| General-purpose single-phase inverter | 68 µH; 20 A RMS | 7–10 mΩ; approximately 2.8–4.0 W at 20 A | Check the manufacturer’s current-rating test conditions, including ambient temperature, PCB copper, and airflow; these conditions vary between designs. | Evaluate core loss and winding AC loss at the intended frequency and waveform. A DC-resistance value alone does not predict total inductor loss. | Approximately 40 × 40 × 25 mm | Through-hole PCB mounting with nearby mechanical support, or a bolted base for heavier constructions. | A balanced starting point for moderate current; verify inductance under DC bias as well as at small-signal test conditions. |
| Higher-current motor-drive inverter | 47 µH; 35 A RMS | 3–5 mΩ; approximately 3.7–6.1 W at 35 A | Allow for winding hot spots and enclosure temperature. Validate the complete assembly under representative load and airflow. | Check core-loss curves at the operating flux swing and switching frequency; assess proximity and skin-effect losses in the winding at higher frequencies. | Approximately 50 × 50 × 30 mm | Bolted chassis or baseplate mounting, with short, wide electrical connections and vibration-resistant hardware. | Consider parallel winding paths or a suitable conductor construction where AC winding loss is significant. |
| High-current power-conversion stage | 33 µH; 50 A RMS | 1.5–2.5 mΩ; approximately 3.8–6.3 W at 50 A | Use thermal measurements or validated thermal analysis at worst-case ambient and load; account for nearby heat sources and restricted airflow. | Request loss data for the intended frequency, flux density, and temperature. Confirm that peak current remains below the specified saturation limit. | Approximately 60 × 60 × 35 mm | Rigid chassis or baseplate mounting; design terminals and busbars for current, temperature rise, and mechanical stress. | Low DCR can reduce conduction loss, but the larger current and core may increase size and stored energy; check switching-ripple and fault-current requirements. |