| 1 | Define the exact device specification | Package type, pin count, operating temperature, supply-voltage range, output drive, and approved revision | All required parameters must match the latest approved datasheet, drawing, and engineering change notice | Document review and engineering approval before purchase order release | Approved part specification and revision-controlled bill of materials |
| 2 | Qualify the supply channel | Traceability, authorization status, manufacturing location, date-code visibility, and packaging integrity | Require lot-level traceability, original packaging, readable labels, and a documented chain of custody | Supplier questionnaire, packaging inspection, certificate review, and sample audit | Supplier qualification file and approved-source list |
| 3 | Establish a receiving sample plan | Inspection level, lot size, sample size, critical defects, major defects, and minor defects | Use a documented attribute-sampling plan such as ANSI/ASQ Z1.4; use zero acceptance for safety- or function-critical defects | Random sampling across multiple reels, trays, date codes, and production lots | Inspection report with lot identification and accept/reject decision |
| 4 | Perform visual and authenticity screening | Marking quality, surface condition, lead condition, coplanarity, package dimensions, and moisture-barrier packaging | No sanding, resurfacing, inconsistent markings, bent leads, corrosion, cracked packages, or broken seals | Microscope inspection, dimensional measurement, label comparison, and package photography | Visual inspection checklist and photographic evidence |
| 5 | Test electrical performance | Continuity, leakage current, supply current, input/output thresholds, timing, gain, and functional behavior | Test limits must be taken from the approved datasheet under the specified voltage, load, and temperature conditions | Calibrated semiconductor tester or validated application test fixture | Raw test results, equipment identification, calibration status, and operator record |
| 6 | Control storage and handling | Humidity exposure, floor life, storage temperature, electrostatic discharge protection, and solderability risk | Follow the moisture-sensitivity level and floor-life limits stated on the label or packing specification; use ESD-protected handling | Packaging-label review, humidity-card inspection, warehouse log, and ESD audit | Storage history, environmental records, and material-status label |
| 7 | Build a long-term procurement plan | Annual demand, lead time, lead-time variability, safety stock, minimum order quantity, and lifecycle status | Set reorder points from demand during replenishment lead time plus approved safety stock; review forecast and lifecycle risk quarterly | Monthly inventory review, supplier capacity confirmation, and periodic risk assessment | Rolling forecast, framework agreement, approved alternates, and continuity plan |